JPH0341470Y2 - - Google Patents
Info
- Publication number
- JPH0341470Y2 JPH0341470Y2 JP17787686U JP17787686U JPH0341470Y2 JP H0341470 Y2 JPH0341470 Y2 JP H0341470Y2 JP 17787686 U JP17787686 U JP 17787686U JP 17787686 U JP17787686 U JP 17787686U JP H0341470 Y2 JPH0341470 Y2 JP H0341470Y2
- Authority
- JP
- Japan
- Prior art keywords
- dicing tape
- semiconductor element
- support pin
- vacuum suction
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 53
- 238000005192 partition Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17787686U JPH0341470Y2 (en]) | 1986-11-18 | 1986-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17787686U JPH0341470Y2 (en]) | 1986-11-18 | 1986-11-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6382941U JPS6382941U (en]) | 1988-05-31 |
| JPH0341470Y2 true JPH0341470Y2 (en]) | 1991-08-30 |
Family
ID=31119487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17787686U Expired JPH0341470Y2 (en]) | 1986-11-18 | 1986-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341470Y2 (en]) |
-
1986
- 1986-11-18 JP JP17787686U patent/JPH0341470Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6382941U (en]) | 1988-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000353710A (ja) | ペレットピックアップ装置および半導体装置の製造方法 | |
| JPH03270048A (ja) | 真空チャック | |
| JPH0341470Y2 (en]) | ||
| JPH03278554A (ja) | チップトレーの構造 | |
| JPH0354858B2 (en]) | ||
| JPH0376139A (ja) | 半導体素子突上げ方法 | |
| JP2517025B2 (ja) | 半導体ウェハ・マウンタ | |
| JPS62210635A (ja) | 物体の分離方法及び装置 | |
| JP2565673Y2 (ja) | ウエハの保持装置 | |
| JPS6234444Y2 (en]) | ||
| JPH05152418A (ja) | チツプピツクアツプ装置 | |
| JP3509538B2 (ja) | チップの突き上げ装置 | |
| KR100505340B1 (ko) | 반도체 칩 픽업 장치 및 방법 | |
| JPH0217480Y2 (en]) | ||
| JPH08306711A (ja) | チップ剥離装置及びチップ剥離方法 | |
| JPH0714860A (ja) | 半導体装置の実装装置及びその実装方法 | |
| JPH04793B2 (en]) | ||
| JP2534101Y2 (ja) | 吸着コレット | |
| JPS60257537A (ja) | ダイボンデイング装置 | |
| JPH0214547A (ja) | 電子部品のピックアップ装置 | |
| JPS63228638A (ja) | チツプ取出し装置 | |
| JP2557433B2 (ja) | ペレットマウント装置 | |
| JPH01268147A (ja) | チップ突上げ用コマ | |
| JPH01134944A (ja) | 半導体素子のピックアップ方法 | |
| JPH0135473Y2 (en]) |